In April this year ~ INTEL will introduce into the 22NM process with foot-bit processor with H61/H67/P67/Z68
After a few days ago to start 3770K. To go crazy with the memory test than the tone
Until two days time to do Overclocking CPU itself ..
Fortunately, unexpected test finished .. .. .. I can only say that failure is 22NM to 22NM also
INTEL first talk about the advantages of new processes
Performance of higher average efficiency of about the same time clocked about 10% higher than 2600K
Memory controller more .. (before that in another article I would have said .. DDR3-2800 will be a basic disk overclockers)
Support PCI-E 3.0 bandwidth provided direct and higher graphics and a variety of high-speed peripherals for use
Finally .. the smaller the process theoretically. The lower the temperature. Salvation can be higher
Only in the process found during transfer .. When DIE (CPU core) segment in the process not the process of narrowing
Relatively narrow area of contact with the metal cover ......
Caused by heat can not be quickly transmitted to the metal cover. Not to mention the metal cover to the radiator of the
In addition to the dry ice and a very low temperature of liquid nitrogen cooling outside air cooling or water cooling ... This has been unable to conduction through the metal cover
Effectively suppress the temperature of the CPU core
I believe there are players playing all know overclocking When the temperature to a certain extent .. CPU will enter protected
The first stage is to slow down .... This wide limits in the mill to enlarge the case when the next process until 32NM
Are also seen as process improvements brought about by the frequency increase
Unfortunately 22NM first generation process. And not because of improved CPU Lid with CPU DIE (core) between the conduction
The frequency of the CPU itself can enhance the upward
Now see is 5.2 ~ 5.3G to boot into the system very easy to run single-core software testing .. very easy
But when fully loaded all the time ...... core temperature will rapidly climb to the top of INTEL .. easy to protect the value of 105 degrees!!
Then the CPU will immediately slow down ...
Have on hand a few 3770K ... to present at room temperature. .. Regardless of water-cooled or air cooled full load burn-in to the frequency of the core
Probably only to 4.8G, though still down ..... other than 2600K 32NM process of 5G burn more higher performance
But the spin-down gap caused by the test data is difficult to elegant ... In other words - when IVY listing. You will see a bunch of 5.2 ~ 5.3G of the CPU (or higher).
But can only run single core less core test .. can not do the core full load burn-~ "~
Of course there are nearly four months away from the market .. (NDA about a dozen numbers in April) may be introduced improved version of the INTEL
May stop there .. can only say that the current through a friend to return the results .. INTEL INTEL only answer process questions
.. Can not be solved unless there is further improvement of the process ...
Why the switch to 22NM particularly evident?
Personal push policy there may turn 3D process with INTEL .. cause the reduced die area (D), leading with the CPU to transfer heat between the metal cover less!!
But not entirely bad news friends .. memory has reached an unprecedented intensity of the state of!!